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QCN9024 Wireless Module 4x4 MIMO PCIE3.0 Qualcomm WiFi6 chipsets series MX6924 F5

QCN9024 Wireless Module 4x4 MIMO PCIE3.0 Qualcomm WiFi6 chipsets series MX6924 F5

Category: Industrial WiFi Module Series

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MX6924 F5 802.11ax Embedded Wireless modules is an embedded wireless module that adopts M.2 E-key and supports PCI Express 3.0 protocol. It adopts Qualcomm® 802.11ax Wi-Fi technology, supports the 5180-5850GHz frequency band, has AP and STA functions with 4x4 MIMO and 4 spatial streams, suitable for applications of 5GHz IEEE802.11a/n/ac/ax. It is equipped with a dynamic frequency selection (DFS) function which has higher transmission efficiency than the previous.


Type: Wireless Module

Chip: QCN9024

IEEE Standard: IEEE 802.11ax

Connector: PCI Express 3.0, M.2 E-key

Working voltage: 3.3V

Frequency range: 5180~5320GHz 5745~5825GHz

Modulation technology: 802.11n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM) ;802.11ac: OFDM (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM) ; 802.11ax: OFDMA (BPSK, QPSK, DBPSK, DQPSK, 16-QAM, 64-QAM, 256-QAM, 1024-QAM, 4096-QAM)

power (per chain): 802.11ax: Max. 24dBm

Power consumption: ≦15W

Receiving Sensitivity: 11ax:HE20 MCS0 <-95dBm / MCS11 <-62dBm;HE40 MCS0 <-89dBm / MCS11 <-60dBm;HE80 MCS0 <-86dBm / MCS11 <-56dBm;HE160 MCS0 <-87dBm / MCS9 <-64dBm

Antenna Connector: 4 x U. FL

Operating Environment: Temperature: -20°C to 70°C/-4 ~ 158℉; Humidity: 95% (non-condensing)

Storage Environment: Temperature: -40°C to 90°C/-40 ~ 194℉; Humidity: 90% (non-condensing)

Certification: RoHS/REACH

Weight: 18g

Dimensions (W*H*D): 55.9 x 52.8x 8.5 mm (±0.1mm)

Module Size


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